منابع مشابه
The Effect of Micro-Alloying of Sn Plating on Mitigation of Sn Whisker Growth
Tin (Sn) is a key industrial material in coatings on various components in the electronics industry. However, Sn is prone to the development of filament-like whiskers, which is the leading cause of many types of damage to electronics reported in the last several decades. Due to its properties, a tin-lead (Sn-Pb) alloy coating can mitigate Sn whisker growth. However, the demand for Pb-free surfa...
متن کاملPreparation and Characterization of Copper Powders with Sn Coating by the Electroless Plating
In this work, Sn-Cu composite powders were produced using an electroless process. The tin content on the surface of copper powders was varied by using di erent concentrations of SnSO4 in the plating bath. The surface morphology of the produced Sn-Cu composite powders was characterized using scanning electron microscopy (SEM). Energy dispersive spectroscopy (EDS) was used to determine the elemen...
متن کاملMonoanionic Tin Oligomers Featuring Sn–Sn or Sn–Pb Bonds: Synthesis and Characterization of a Tris(Triheteroarylstannyl)Stannate and -Plumbate
The reaction of the lithium tris(2-pyridyl)stannate [LiSn(2-py)3] (py6OtBu = C5H3N-6-OtBu), 1, with the element(II) amides E{N(SiMe3)2}2 (E = Sn, Pb) afforded complexes [LiE{Sn(2-py)3}3] for E = Sn (2) and E = Pb (3), which reveal three Sn–E bonds each. Compounds 2 and 3 have been characterized by solution NMR spectroscopy and X-ray crystallographic studies. Large 1J(119Sn–119/117Sn) as well as...
متن کاملSolder Joint Reliability of Pb-free Sn-Ag-Cu Ball Grid Array (BGA) Components in Sn-Pb Assembly Process
For companies that choose to take the Pb-free exemption under the European Union’s RoHS Directive and continue to manufacture tin-lead (Sn-Pb) electronic products, there is a growing concern about the lack of Sn-Pb ball grid array (BGA) components. Many companies are compelled to use the Pb-free Sn-Ag-Cu (SAC) BGA components in a Sn-Pb process, for which the assembly process and solder joint re...
متن کاملThe Kinetics of Formation of Ternary Intermetallic Alloys in Pb-Sn and Cu-Ag-Sn Pb-free Electronic Joints
A simple model of the formation of Au0.1Ni0.1Sn0.8 in Pb-Sn solder/Ni interconnects is examined by numerical simulation. Previous experimental observation has shown that after reflow the interface consists of the Ni3Sn4 alloy between Pb-Sn solder and Ni, with Au distributed through the PbSn solder ball. Au0.1Ni0.1Sn0.8 was observed to form at the Pb-Sn solder/Ni3Sn4 interface during annealing a...
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ژورنال
عنوان ژورنال: Journal of The Surface Finishing Society of Japan
سال: 2015
ISSN: 0915-1869,1884-3409
DOI: 10.4139/sfj.66.191